Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

Infineon receives approval for funding under the EU Chips Act

Electronics

Intel set to begin 18A tape-outs later this year, according to reports

Automotive

Microchip extends maXTouch M1 generation family to support shaped automotive displays

Semiconductors

STM32C0 MCUs to ease entry into embedded development

Electronics

Microsoft’s quantum claims

Robotics & UAVs

SICK partners with Universal Robots to deliver safer cobots

Sensors

Mouser offering RRH47000 CO2 sensor module from Renesas

Electronics

Applied Materials accelerates chip defect review with eBeam system

Optoelectronics

ST unveils new silicon photonics and next-gen BiCMOS proprietary technologies

Electronics

AheadComputing raises funds to support ‘breakthrough’ microprocessor architecture

Automotive

ROHM TVS diodes support high-speed CAN FD in-vehicle communication systems

Power

SemiQ 1200V SiC full-bridge modules simplify applications development