Engineering publications brought to you by Mark Allen

Neil Tyler

Power

Infineon introduces compact CoolSET System in Package (SiP)

Electronics

Intel’s new manufacturing process attracts interest

Electronics

CORNERSTONE advances its silicon photonics services with new E-beam lithography capability

Interconnection

Amphenol RF expands its SMA cable assembly portfolio

Electronics

Imec to coordinate development of EU Chips Design Platform

Electronics

EU likely to miss 2030 microchip target

EDA & Design Software

Codasip looks to accelerate CHERI adoption

Sensors

LEM extends IN family of current sensors with two new products

Electronics

Synopsys and Intel Foundry announce EDA and IP collaborations

Electronics

SMD Semiconductor opens R&D Innovation Hub at CSA Catapult in Newport

Electronics

xMEMS extends µCooling Technology to AI data centres

Automotive

Nexperia offering automotive planar Schottky diodes in CFP2-HP packaging