Engineering publications brought to you by Mark Allen

Neil Tyler

Embedded Software

Congatec unveils a fast track to NPU accelerated smart vision

Communications Hardware

Murata Pycom collaboration looks to cut IoT projects time-to-market

Board Level Design

Cadence debuts Allegro X Design Platform

Embedded & Programmable

Xilinx unveils Versal AI Edge series

Power

Radiation-hardened MOSFET targets space applications

Embedded Systems

ARIES starts volume production of the M100PFS SoM

Aerospace

EPC announces radiation-hardened eGaN transistors and ICs

GF and GlobalWafers look to expand semiconductor wafer supply

CPUs

NXP offers beta UWB development tools for U1 chip supported products

Communications Hardware

Point 2 Technology introduces RangeXtender for 5G networks

Displays

NHN selects Graphcore IPU-PODs

Communications Hardware

Ranovus announces second-generation “co-packaged optics” chip