Engineering publications brought to you by Mark Allen

Neil Tyler

Applications for Subcon’s Launchpad start-up zone extended to 8th August

Board Level Design

MIKROE introduces LTE IoT 8 Click board

Automotive

CAST and Avery Design Systems expand IP partnership

£53 million digital technology funding boost for UK manufacturers

Memory

Nexperia looks to enable large logic functions in small form factor systems

Embedded Systems

ST manufactures first 200mm silicon carbide wafers

Communications Hardware

8-Channel ReDriver with internal coupling looks to enhance signal quality

Embedded & Programmable

GOWIN Semiconductor announces ISP IP core and solution

Board Level Design

Bulgin launches connector/cabling configuration tool

Communications Hardware

Easier user interface design of IoT applications

Memory

CrossBar announces ReRAM Based PUF Keys

Research Design

Funding for next generation diamond-enabled technologies