Engineering publications brought to you by Mark Allen

Neil Tyler

Automotive

NXP collaborating with Foxconn on next generation vehicle platforms

Policy & Business

Talent shortage stifling growth

Interconnection

Harwin Hi-Rel connectors deliver improved board-to-board spacing

Electronics

Longer lasting sodium-ion batteries

5G

Ericsson, Qualcomm and Thales look to take 5G into space

Electronics

Flex Logix partners with Intrinsic-ID to secure EFPGA platform

Wireless Technology

u-blox unveils first cellular module featuring an embedded SIM (eSIM)

Memory

Rambus expands DDR5 Memory Interface chips portfolio

Board Level Design

Motor-drive reference designs from STMicroelectronics

Communications

IPOL DC-DC buck regulator power modules

Automotive

Inova Semiconductors signs technology agreements with NXP and Microchip

Electronics

Move over silicon