Engineering publications brought to you by Mark Allen

Neil Tyler

Electromechanical

OKW’s Hand-Terminal plastic enclosures available in two versions

Power

ENNOVI unveils new battery technology

Electronics

Navitas GaN and SiC technologies to enable next-gen AI power delivery

Distribution

Farnell strengthens industrial SBC line card with Advantech products

EDA & Design Software

DVCon Europe 2024 launches call for Papers, Tutorials and Panels

Interconnection

Fairview Microwave presents high-power RF fixed attenuators with 2.4 mm connectors

Electronics

Cadence to acquire BETA CAE and expands into structural analysis

Electronics

Could ASML look to move abroad?

Memory

sureCore announces ultra-low power memory IP for AI applications

Automotive

TTTech Auto and BlackBerry QNX to tackle future SDV complexity

Automotive

ADI and BMW to provide 10Mb ethernet for automotive, enabling software-defined vehicles

Embedded Systems

SEGGER’s J-Link debug probes now support Renesas RZ/V2H MPU