Engineering publications brought to you by Mark Allen

Grenoble based collaboration to research 3d ics and photonics integration

Bluetooth audio module cuts wireless speaker development time

Harriet Green to step down as Premier Farnell ceo

Altera: Implementing PCIe in Altera FPGAs

IQD launches new series of high temperature clock oscillators

Quad dsp audio processor to help oem product differentiation

Hall effect switch aids portable product miniaturisation

Three axis MEMS accelerometer operates within full scale range of ±200g

IHS: One counterfeit part reported every 15 seconds

New WEEE reuse specification aims to reduce the number of illegal exports

Always connected, always safe: Technology provides a guiding hand for car drivers

Expert panel: Innovation, collaboration and competition are hot topics for semiconductor developers