LEC-3517 is the product of our ARM-focused SMARC product line, delivering ultra-low power consumption and cost-effective solutions to shorten time-to-market
ADLINK Technology announced the introduction of the LEC-3517 ARM-based Smart Mobility Architecture (SMARC) form factor computer-on-module (COM). The ADLINK LEC-3517 is built on a TI AM3517 System on Chip (SoC), using an ARM Cortex-A8 processor at 600MHz and with a power envelope of less than 2 watts. With an extraordinary performance-to-power ratio, the LEC-3517 enables system architects to use a fully passive cooled system design, ideal for portable and stationary embedded devices such as industrial handhelds, control terminals, Human Machine Interfaces, medical devices, and industrial tablets. ADLINK's LEC-3517 utilizes the short version of the SMARC module definition (82 mm x 50 mm) and offers 256MB DRAM, 512MB NAND flash on-board. The module supports 18/24-bit parallel LCD displays and 8-bit camera input. The LEC-3517 also features a USB 2.0 host port and a USB client port, four serial ports and a CAN bus port, and one 10/100 Ethernet port, as well as 12 GPIO signals. Off module storage can be implemented through either SDIO or eMMC on the carrier. Standard operating systems include Linux, Android, and Windows CE, with corresponding board support package (BSP). Along with the release of the SMARC module, ADLINK also introduces the SMARC carrier board, LEC-BASE. The LEC-BASE functions as a reference design for the LEC product line, and also as a setup for software development and hardware testing. The LEC-BASE offers myriad I/O in addition to the basic I/O function of the CPU modules. It provides an combined HDMI/DP output, alternative RGB 18/24 bit or HDMI, LVDS 18/24 bit, a keypad and touchscreen controller, GPS and G sensors, 1x GbE, HD Audio, SPDIF, CSI-2 camera input, RGB camera input, SD/SDIO, eMMC/SD/SDIO, GPIO, 4x UART, 2x USB, 1x USB OTG, 1x CAN, 2x PCI Express 1x (PCIe), and one SATA interface. Two mini PCIe sockets enable use of Wi-Fi / Bluetooth and 3G modules for connectivity. The BSP for each CPU module is configured to support the entire on-board functionality to minimize delays in testing and maximize time for application development. The LEC-3517, as intended with the SMARC standard, can be seen as a building block to allow for effective development and a future upgrade path with coming generations of SMARC COMs. To meet the demands of industrial-grade applications, the LEC-3517 uses the robust and vibration-resistant 314 pin MXM connector, and is available with extended operating temperatures from -40OC to +85OC. The SMARC standard is a versatile, small form factor, computer module standard jointly developed by ADLINK and other leading embedded companies. The SMARC standard is a vendor-independent standard that is held by the SGET (Standardization Group for Embedded Technologies) and was officially ratified in March 2013. The SMARC Design Guide V1.0 was finalized in August and is available for download from the SGET SMARC website: http://www.sget.org/standards/smarc.html. For more information on the LEC-3517 and LEC-BASE, please visit www.adlinktech.com.