Product Launches

Embedded Systems

ADLINK’s COM-HPC module offers i9, 24 cores, and 36MB cache at 65W TDP

RF & Microwave

Wi-Fi 6E components handle frequencies up to 12 GHz

Interconnection

Cinch Connectivity Solutions unveils mmWave Angled 30-degree product family

Power

Infineon adds to OptiMOS 5 portfolio targeting high power ECUs

Board Level Design

THERM-A-GAP GEL 50TBL, a dispensable thermal gel for thin bond line applications

RF & Microwave

New remote electrical tilt antennas

Power

MOTIX MCU embedded power IC-families with CAN FD interface

Automotive

Littelfuse unveils SZSMF4L automotive grade 400W TVS diodes

Internet of Things

Amphenol RF expands its antenna portfolio with NFC antennas

Embedded Systems

Embedded NUC boards and systems now with AMD-processors

Interconnection

Binder unveils 696-series harsh-environment connector

Interconnection

Amphenol RF expands 12G broadcast portfolio with new BNC adapter