The VPX3010 Series is SWaP-optimised and functions in temperatures ranging from -40 to 85°C. The blade includes DDR4-2133 soldered ECC SDRAM up to 16GB; 2x 10G-KR and up to 3x 1GbE; up to PCIe x16 Gen3 interface supporting non-transparent bridge; one XMC expansion slot with PCIe x8 Gen3 with Rear I/O to P2; USB 3.0 and SATA 6Gbit/s for high I/O throughput.
The VPX3010 series is available as both convection and conduction-cooled with conformal coating to support the requirements of mission-critical applications in military and aerospace, such as radar, digital signal processing, unmanned aerial/ground vehicles, and electronic warfare.
The device supports VPX and VPX REDI VITA specifications, as well as VITA 65 OpenVPX architecture framework and MIL-STD-810G. A VPX-R3010 rear transition module is available to access rear I/O signals, and a tBP-VPX3000 test backplane supporting three payload slots is available for users to validate VPX3010 functionality.
The module includes support for software coverage, such as Windows 7, Windows Embedded 7, Linux, and real-time operating systems.