A new package platform is being rolled out across Ampleon’s LDMOS and GaN product portfolio. More than a dozen variants of the SOT502 and SOT539 platforms are said to be in development.

The ACP3, a copper flanged air cavity package will initially be available for GEN9 and GEN10 high power RF transistors and the first products to use it will be the BLC9G20XS-400AVT, BLC9G20XS-550AVT and the BLC9G22XS-400AVT.

According to the company, the ACP3 format offers ‘double digit’ cost savings compared to previous packaging platforms and a thermal resistance typically 25% lower than other formats. The package also supports higher power capability, improved reliability, gain and efficiency.

Key applications for ACP3 devices include use in power amplifiers for LTE radio access networks where the commercial pressures of cost, size and power consumption are paramount, as is the need to increase data rates and quality of service