Low-profile hybrid FPC-to-board connector from Hirose

Hirose has developed a low-profile hybrid FPC-to-board connector with a rated current of 5A power and 0.3A signal in a miniature footprint.

With a 0.3 mm pitch, 0.6 mm stacking height and 1.9 mm width, the space-saving BM57 Series connector is well-suited for a wide range of consumer and portable electronic devices.

A fully armoured design covers both ends of the housing with metal for enhanced robustness and a significant reduction in the risk of housing damage from misalignment when mating. A wide self-alignment range of ±0.22 mm in the pitch direction and ±0.3 mm in the width direction, along with guidance ribs provides smooth mating operation.

Offering enhanced PCB peeling strength, the rugged BM57 Series features three solder retention tabs at each power contact. An insert moulded header and receptacle prevents solder wicking into the contact area.

The BM57 FPC-to-board connector is commonly used in smartphones, laptops, tablets, gaming consoles and wearable devices.