High current photorelay suits testing applications
Toshiba has introduced a high current (3.3Amax.) photorelay for testing applications, including power line switching, feedback resistance switching and measuring line switching.
The TLP3107 is housed in a 6.3 x 7mm 2.54SOP6 package. Offers low on-state resistance and high permissible on-state current, it is also expected to find applications in factory automation and security systems.
Consisting of a photo MOSFET optically coupled to an infrared light emitting diode, the new photorelay utilises the latest generation trench MOSFET to realise an approximately 1.4x higher on-state current than Toshiba's existing product, the TLP3103.
This performance, combined with a 3.3A (max.) output, is aimed at accelerating the replacement of mechanical relays in applications that require high density assembly. Toshiba says replacing a 3A-capable DIP package with the 2.54SOP6 package reduces the assembly area by 40%, and the overall product height by half.
Other features include trigger LED current 3mA (max); off-state output terminal voltage 60V (min); and isolation voltage 1500Vrms (min).
