Altium: Stand K2
Altium UK will be presenting two workshops for modern circuit board designers at EDS.
The New Age of Documentation workshop will highlight the requirements needed for providing a comprehensive documentation package for the PCB manufacturer.
The Conquering Multi-Board Design Challenges to Create Next-Generation Electronics workshop will illustrate how to properly manage board-to-board connectivity in multi-board designs. Ensuring that connector locations on different boards physically align is a challenge. Understanding how to create, align, and verify system-level connectivity for your multi-board design in a system-level PCB environment is critical. This will not only help to avoid connectivity errors, but will also mitigate the need for additional time-consuming iterations.
Altium will also be offering individual demonstrations on its latest innovations, including a sneak preview of the upcoming Altium Designer 19 release.
binder UK: Stand M12
binder UK will be showcasing examples from its range of circular connectors including its Harsh Environment Connector (HEC) UL approved, industrial connectors at this year’s show.
The Series 696 HEC connectors are resistant to UV, temperature fluctuations, acid rain, salt spray, ozone and other pollutants and feature a secure, three-point fast locking mechanism with a robust coding system that prevents incorrect orientation. They are manufactured from a tough UL 94V-0 rated polyamide, are waterproof and dustproof to IP68/IP69k, and the use of crimp contacts makes for vibration-proof terminations.
The latest addition to the HEC Series is a power connector capable of handling up to 32A at a rated voltage of 600V. The power connector is available in both cable and panel mount formats with 4+PE silver plated male or female contacts and, according to binder, are good for more than 1000 mating cycles.
BCD-Atlantik: Stand E12
Register for BCD-Atlantik’s workshop event and you’ll come away understanding the key elements, requirements and benefits of an IoT Gateway. BCD will be discussing the architectural choices and the device and connection management options; security of these connections from the IoT network and that of data transported to the Cloud will also be considered.
Visitors will also be able to view a selection of the latest Gateway products, from BCD’s key suppliers, including the new xPico 200 Series Module from Lantronix: an industrial-grade high performance Wi-Fi, Bluetooth, and Ethernet connectivity solution with enterprise security. From Digi, it will demonstrate the Digi Connect Sensor+, a roll-out ready, battery-powered cellular gateway solution. The Qualcomm QCA4020 will also be displayed, a complete tri-mode system-on-chip with support for dual-band Wi-Fi, Bluetooth 5 and 802.15.4-based technologies, including Zigbee and Thread.
ByteSnap Design: Stand L22
Embedded systems consultancy, ByteSnap Design, will be highlighting a number of new developments at EDS, including the launch of a new version of its SnapUI development tool for QNX, a V2G project update and a demo of motor control design skills.
SnapUI is a lightweight user interface (UI) development tool which streamlines the UI prototyping and building process, enabling QNX users to edit an application’s UI independently from the core of the application itself.
ByteSnap’s consultants will also be showcasing their experience in developing products for the electric vehicle charging market. Earlier this year, the company and a consortium of partners were awarded a two-year collaborative project, VIGIL (Vehicle-to-Grid Intelligent Control), under a Vehicle-to-Grid (V2G) competition, funded by the Office for Low Emission Vehicles (OLEV) and the Department for Business Energy and Industrial Strategy (BEIS). The V2G project will see ByteSnap developing an OCPP module and companion Android app.
While an overhead cable car demonstration will show how ByteSnap’s engineers use their motor control design skills to optimise product development. The 3D-printed cable car houses a 360-degree camera (with architecture built by ByteSnap) which will send data to a PC, which will then display stitched-together footage.
congatec: Stand H6
congatec has released its first SMARC 2.0 Computer-on-Module based on the 64-bit NXP i.MX8 multi-core ARM processor family: conga-SMX8, and will be showcasing this latest launch at EDS.
This device is designed to provide high-performance, multi-core computing along with extended graphics capabilities for up to three independent 1080p displays or a single 4K screen. Further benefits include hardware-based real-time and hypervisor support, and broad scalability, as well as resistance against harsh environments and extended temperature ranges. All these features make the SMARC 2.0 module meet the recent performance and feature set needs for low power embedded, industrial and IoT, as well as new mobility sector.
Corintech: Stand E50
Visit stand E50, where Corintech, a leading UK Electronic Product Design & Manufacturing Partner with operations in the UK and Hong Kong, will be demonstrating examples of its assemblies.
Its design and development teams offer services including electronic design, PCB layout, product design concepts, mechanical CAD, firmware and software development. While its manufacturing services include PCB assembly, thick film hybrid microcircuits, electro-mechanical assembly and full product assembly, along with competitive component sourcing and Kanban supply.
Experts will also be on hand to discuss the potential cost savings Corintech can offer.
DAU Components: Stand Z59
DAU Components, the distributor with 35 years of experience in low cost IEC60320 and EMI/EMC components and connectors, will be at stand Z59, where visitors can cast an eye over its inlets, outlets, power entry modules, ganged outlets and rewireable connectors and plugs, filtered inlets, and much more.
Whether you are looking for a cost down on your BoM, or help with a new project, the DAU Components team will work closely with its manufacturing engineers and partners to provide customers with design, sales and logistics support, along with reliable cost effective pricing and high service levels.
EuroQuartz: Stand F2
EuroQuartz will be exhibiting its latest frequency control products, including high speed current steering logic (HCSL) versions of the company’s ultra-low phase jitter EQJF clock oscillator range; oscillators from Statek; and a range of switchable crystal oscillators offering users the ability to provide four different frequencies.
Offering a range of frequencies from 50 to 700MHz, ultra-low phase jitter EQJF clock oscillators with HCSL outputs deliver a less noisy solution compared with static logic type and has a phase jitter of 150fs typical, 300fs maximum.
EQJF series HCSL oscillators feature a choice of supply voltages – 1.8, 2.5 or 3.3V – with frequency stability specifications of ±25, ±50 and ±100ppm over both commercial (-10 to +70°C) and industrial (-40 to +85°C) temperature ranges available as standard.
Hitaltech: Stand L48
Innovation, interaction, inspiration and insight are the themes of this year’s expo, and Hitaltech is aiming to display all of the above with its Conex-it brand of PCB-mounted screwless terminal blocks and connectors.
Since Hitaltech last appeared at EDS, the company has introduced a range of added-value service, such as full colour printing, loom assembly and kitting.
Hitaltech also tailors bespoke component kits for each client, with every bag containing a pre-defined set of terminal blocks and connectors, coloured and printed to the customer’s requirements.
LEMO: Stand H52
At LEMO’s stand, visitors can expect to see its new, compact, lightweight, sealed connectors, specifically designed for outdoor applications.
LEMO will be highlighting a range of reliable connectors and cable assemblies with prominence given to the T Series push-pull self-latching multipole connector. This rugged, sealed connector features IP68 rating and is ideal for applications ranging from medical, to test and measurement and industrial controls.
Lascar Electronics: Stand H45
Looking for a genuine one-stop-shop for your product design and manufacturing requirements? Or perhaps you need just one element of the product mix? From electronic and mechanical hardware design to full custom Cloud platforms and smartphone apps, Lascar brings your test and measurement ideas to life.
Lascar have a broad scope of disciplines encompassed by its Engineering Design and Development team, including electronic, mechanical, display and software design. It offers an extensive range of prototyping options from one off space models, to small run PCB and display assemblies.
If you’re ready to take your test and measurement instrument into the IoT arena, the Lascar team can assist with multiple disciplines, including Cloud, app and software development. Visit Lascar at Stand H45 to chat about your custom requirements and demo some of its unique display and IoT solutions.
Lumberg: Stand L40
In addition to its existing IP67 Circular Din Connector range, Lumberg has recently introduced its all-new IP67 series, QuickLock. The connector’s quick snap latch feature facilitates the connection and disconnection of the mating half. The easy mating and UL approved connector is available in 2 to 12-pin.
The QuickLock cable connector, cable socket and chassis socket come in three different sizes: 12, 16 and 20mm. For maximum performance, the 20mm version can accommodate higher currents of up to 20Amps. These IP67 high performance connectors are designed to provide a reliable connectivity solution for a variety of applications in the test and measurement, medical, industrial and automation industries.
Alongside Lumberg, its sister company, Lutronic, will be showing its range of actuator and sensor wiring solutions. Lutronic focuses on manufacturing quality M8 and M12 circular connectors for customised signal, data and power applications.
OKW Enclosures: Stand J56
METCASE, manufactured by OKW enclosures, will be launching a new 19” mini-rack version of its TECHNOMET instrument enclosures at this year’s show.
These cases are designed for mounting standard 19” subracks, chassis and front panels. Applications will include test and measurement equipment, networking and communications devices, sound and studio systems, laboratory instruments, industrial computers and control systems.
These housings combine diecast aluminium front and rear bezels, a folded case body and chassis, and four snap-on cover trims to create a flush-fitting cohesive design with no visible fixing screws.
Pulsonix: Stand H75
Pulsonix will be introducing 3D PCB design capability with its Version 10.0 release that allows mechanical enclosures to be integrated into the native Pulsonix 3D environment for modelling and critical clash detection.
This 3D design environment is complemented by interactive functionality enabling dynamic Copper Pouring and shape healing. Automatic Pad Style Naming has also been introduced.
The integration alerts of Version 10.0, notifies engineers where items violate the rules defined. Once alerted, the offending item can be moved from within the 3D Editor and all changes automatically updated in the PCB design.
SCHURTER: Stand L20
This year, SCHURTER will be exhibiting its latest capacitive touchscreens, specifically designed for ATEX class 1 environments, along with its RTS fuse surface mount thermal fuse that protects against thermal runaway of power semiconductors.
SCHURTER will also be demonstrating its fully customisable Luminos key backlighting solutions and latest capacitive switch designs utilising PMMA as lens material instead of glass.
Selectronic: Stand G35
Selectronic will once again be at EDS, showcasing its expanding range of display products and solutions. A feature of this year’s stand will be a range of larger displays – including its square-aspect 22- and 33-inch TFTs panels and full-colour LED tiles for the video wall and large panel display market.
Other LED offerings will also include UV and automotive grade products, as well as Selectronic’s IR LEDs series which now feature light sensors for the expanding IR market in control function applications.
Simms International: Stand F5
This is the first time at EDS for Simms International, which will be showcasing a range of industrial grade products, including SD and microSD cards from manufacturer, ATP Electronics.
ATP’s range of industrial SD and microSD cards are designed for automotive, automation, networking, enterprise mobility and healthcare industries to name a few. Its cards are engineered with intelligent technologies which include: advanced wear levelling algorithm, bad block management, life monitoring and ESD resistance. Other features of ATP cards include System in Packaging, controlled BOM, advanced wear levelling, secure erase and -40°C to 85°C wide temperature operation and no MOQ.
Swindon: Stand H2
Swindon is giving visitors the opportunity to try its online chip size estimator, IC Builder. This device offers designers a new way to estimate the size of an ASIC solution designed specifically for their application. It enables the user to progressively add functions, such as memory type, communication protocols, power management and actuation device type, required for their intelligent sensing application and the capability to see what the resulting package could look like.
TDK-Lambda: Stand K30
TDK Corporation has launched five new models to the TDK-Lambda brand 5kW GENESYS+ series of high power density programmable DC power supplies, which it will be showcasing at this year’s EDS.
This expansion now provides incremental and seamless choices in output voltage and current ranging from 0 10V/500A to 0 600V/8.5A. Initially launched in 2017, the GENESYS+ is designed to provide users with higher efficiency and improved performance; and is functionally compatible with existing TDK-Lambda Genesys and Z+ programmable power supplies.
Wilson Process Systems: Stand K8
With component shortages set to continue across MLCC’s and chip resistors, Wilson Process Systems with its newly appointed ISO9001-2015 has been proactive in its procurement plan and is looking to attract new customers at EDS by way of its large standard inventory.
Steve Cooke, Sales Manager, commented: “Purchasing was able to secure inventory over and above our requirements across many typical values, allowing us that bit more flexibility when engaging with potential clients looking to overcome current issues.”
Today, Wilson Process Systems prides itself as a true supplier partner, offering a competitive manufacturing resource focused on industrial, commercial and medical sectors within the contract electronics market.
Würth Elektronics: Stand L8
If you would like to see one of Europe’s leaders in electronic and electromechanical components, visit stand L8 where Würth Elektronics will be exhibiting. External business managers and field application engineers will be on hand to answer any technical questions you may have.
Having become the latest member of the Würth Elektronics family, IQD will also be at stand L8, showcasing its range of crystals and oscillators, alongside worldwide leader in the development and production of transformers and custom magnetics, Würth Elektronics Midcom.
Yokogawa: Stand F7
EDS will be the perfect opportunity to hear and see the latest from Yokogawa, the test and measurement manufacturer.
On the booth, it will be showcasing a selection of products from its range of measuring instruments, including “the world’s most accurate WT5000 precision power analyser” that offers measurement accuracy of ± 0.03% combined with stability, noise immunity and plug-in modular flexibility.
Zones at EDS
Along with an extensive and exciting range of exhibitors, EDS will also be welcoming back its popular Innovation Zone, where visitors can view the latest, cutting-edge technology to grace the engineering industry.
EDS will also be dedicating its Future Zone to young and start-up businesses - a brand new feature for 2018.
Furthermore, adventurer Chris Ramsey, the first person to enter the formidable 10,000-mile Mongol Rally in an electric vehicle (EV) with a maximum range of 155 miles, will also be joining EDS this year to discuss EV design in his ‘Plug-in Adventures’ session.
Ramsey will be exploring how EV design has changed in his 7 years in the industry, from mainstream manufacturers to concept cars in Silicon Valley.
With the perceived road blocks to EV being range, battery degradation, and lack of charging infrastructure, Ramsey will share insights into some of his adventures and discuss how the design of today’s EVs coped with the demands of traveling across two thirds of the earth.
For a list of all exhibitors attending EDS, click here.