Engineering publications brought to you by Mark Allen

Product Launches

Power

1.6kW high density hot swap front end power supplies

Memory

Single chip system companion IC for new Intel Atom processor E6xx series

Board Level Design

Intel Atom SBC from Diamond Systems renews interest in stackable architectures

Board Level Design

DesignSpark celebrates as membership reaches 12,000

System Design

Sponsored by OKW: Extended range of designer plastic enclosures

High resolution pressure sensor

Automotive

New IMS prototyping service from PCB-POOL

Power

Power management solution unveiled for single cell Lithium-Ion/Polymer cell systems

Motion controller with Ethernet

Interconnection

DF57 connector series with 1.2 mm pitch

Board Level Design

Open architecture backplanes, extenders and custom designs

Mixed Signal & Analogue

New technology creates 'best practice' for signal and power integrity analysis