TSMC joins Sematech
1 min read
TSMC has announced plans to join Sematech as a core member. The Taiwanese semiconductor fab said the cooperation will focus on semiconductor research and development for IC process technologies for 20nm generation 'and beyond'.
This will include extreme ultraviolet lithography, 3d interconnects, metrology, novel materials and device structures. The collaboration is also set to aid the development of critical infrastructure for next generation manufacturing, including the transition to 450mm wafer size.
"This relationship further reflects our commitment to push the boundaries of innovation and deliver leading edge technology to our customers," said Jack Sun, vice president and cto, Research and Development, TSMC. "This complementary cooperation leverages Sematech's collaborative approach to lead critical industry technology transitions with TSMC's position as an industry leader in advanced technology development and manufacturing."
Dan Armbrust, president and ceo of Sematech, added: "We're excited that this agreement expands our long standing relationship with TSMC and we look forward to their contributions and technical insights from their perspective. TSMC will be an important partner in accelerating the progress of R&D innovations and manufacturing solutions in leading edge technologies."
