TDK-Lambda wins patent for power supply heat sink design

TDK-Lambda UK has been awarded a patent by the UK Intellectual Property Office for a novel power supply heat sink arrangement.

According to the company, the various components in a power supply that dissipate heat require different cooling arrangements and a combination of both surface mount and leaded

components is generally required.

"Available space and electrical clearance was an issue," said Martin Coates, senior electrical design engineer with TDK-Lambda. "We needed a cost effective hybrid solution."

That solution supports both leaded and surface mount components. It uses a traditional IMS board, with surface mounted power components on one side and leaded power semiconductors on the other side. These leaded devices are attached with double sided adhesive tape that offers insulating and thermally conductive properties.

The completed space saving assembly does not use any mechanical fasteners and can be soldered to the main circuit board.