STMicroelectronics has joined forces with Virscient, a wireless and Internet of Things specialist, which now offers support for customers building automotive solutions using ST's Telemaco3P secure telematics and connectivity processors.

Virscient offers support to ST customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP). MTP is a development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor.

MTP aims to enable the rapid prototyping and development of smart-driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles. Virscient brings a deep understanding of wireless connectivity technologies and protocols ideal for architecting connected-car systems that rely on technologies such as GNSS (Precise Positioning), LTE/cellular modems, V2X technologies, Wi‑Fi, Bluetooth, and Bluetooth Low Energy.

The Telemaco3P incorporates dual Arm Cortex-A7 processors with an embedded Hardware Security Module (HSM), an independent Arm Cortex-M3 subsystem, and a rich set of connectivity interfaces.

"We chose to collaborate with Virscient for Telemaco3P-based designs because of their differentiated expertise in the development of embedded systems and wireless technologies, and their proven track record of helping customers take connected products from concept to market,"said Philippe Prats, Head of EMEA Marketing and Application for STMicroelectronics’ Automotive and Discrete products. "The Telemaco3P platform enables our customers to deliver new categories and products in automotive telematics. By working with Virscient, we make this exciting technology accessible to a broader range of innovative companies."

ST and Virscient is exhibiting the Modular Telematics Platform within the ST Automotive Telematics Ecosystem at Embedded World - Hall 4A-138.