Research project aims to explore new chip design methodology
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Seven partners from the German business and research communities are teaming up as part of the three year RELY research project to explore ways of enhancing the quality, reliability and resilience of modern microelectronic systems.
The consortium, which includes Infineon Technologies, X-FAB Semiconductor Foundries, EADS, Fraunhofer-Gesellschaft, MunEDA, Technical University of Munich and The University of Bremen, will focus on applications in transportation, in particular electromobility, in medical technology and automation.
The RELY research project, which sets out to design new development processes for future microelectronic systems, is being supported by the German Federal Ministry of Education and Research with €7.4million funding.
In the course of the research, the partners are seeking to develop novel chip architectures that will allow a chip to automatically determine its operating status, react to it and even enter into interaction with the electronic system.
In order to be able to implement the self test function of chips, the research will initially focus on various preparatory activities. The project partners are also working on extending the modeling of manufacturing technologies, formulating new chip design specifications, defining new characteristics in higher design levels and enabling system simulation and chip verification with respect to reliability.
