Next generation embedded I/O standard announced
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A next generation embedded I/O standard has been announced at Embedded World, which originator, Diamond Systems claims is 'the most significant embedded system expansion innovation since the birth of PC/104 in 1992'.
According to Diamond Systems, although PC/104 and PC/104-like stackable modules have evolved to encompass new technologies, there was a perceived need for an even smaller, lower-profile, mezzanine-style expansion format for use on tomorrow's compact, highly-integrated SBCs and COM baseboards. The FeaturePak standard was developed to fill this gap in what was currently available in the embedded market.
Currently, the FeaturePak specification is being maintained by Diamond Systems along with a small group of early adopters who have become charter members of the 'FeaturePak Initiative.
Diamond Systems says it now plans to transfer ownership of FeaturePak — including its specifications, trademark, and logo — to a suitable standards organisation to make it available to all companies in the embedded market.
The selected organisation will be responsible for maintaining, extending, and promoting the FeaturePak standard, and will have the authority to establish rules associated with use of the FeaturePak logo.