Next gen processors advance broadband communications

The broadband semiconductor and software products provider says the Fusiv Vx185 and Vx183 chipsets combine support for the International Telecommunication Union G.Vector standard, bonding for increased rate and reach, ultra low power and gigabit line rate performance into a single package. It has been designed for advanced services gateways and integrated access devices. By employing industry standard G.Vector, Ikanos' Fusiv products are optimised to enable telecommunications service providers to deploy a 100Mb/s service over traditional copper lines at 1/10th of the cost of fibre. According to the company, the Vx185 processor integrates cost effective support for bonding by natively interfacing directly to two integrated analogue front end devices. This built in support is designed to allow service providers to extend the reach of their advanced broadband services by coupling two pairs of copper wires together. Bonding can also be used to increase the data rate over shorter distances and can be combined with vectoring to push aggregate data rates up to 300Mb/s.