IBM launches innovative chip making technology for power management semiconductors
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IBM has announced new chip making technology for power management semiconductors. This is the company's first foray into a segment seen as critical to the development of alternative energy sources, smart buildings and new consumer devices.
IBM's process integrates wireless communications into a single power management chip, a first that the company says can cut production costs by about 20%. According to IBM this enables a new class of semiconductors – ultra-small and affordable chips that control power usage while they communicate in real time with systems used to monitor smart buildings, energy grids and transportation systems.
The main function of power management chips is to optimise power usage and serve as bridges so electricity can flow uninterrupted among systems and electronics that require varying levels of current.
By using the same chip making process employed in computers and smart phones, IBM claims the CMOS-7HV can lower production costs while allowing for the integration of an unprecedented number of new functions.
"This new process can be used to create new types of affordable wireless sensors, the kind needed to monitor and connect the smart systems coming on line in the next few years - from alternative energy products being developed by industrial firms to consumer companies looking to deliver mobile entertainment," said Michael Cadigan, general manager, IBM Microelectronics Division. "Integrating communications and power sensors on one chip cuts costs for the industry and is an example of our 'smart planet' technology vision - one that we back up with R&D."
IBM is rolling out the new chip making process to manufacturers in the consumer electronics, industrial, automotive, digital media and alternative energy segments. The company is accepting designs from customers and is scheduling full production for the first half of 2011.