EU collaboration to boost the IoT

1 min read

A collaboration of 13 partners has been announced to form the Necomada consortium, which will focus on integrating electronics into a broader range of everyday items in a bid to widen the scope of the IoT and enable Industry 4.0.

The Necomada – Nano-Enabled Conducting Materials Accelerating Device Applicability – project incorporates advanced functional materials to develop customised inks and flexible adhesives that are compatible with high volume manufacturing platforms, with an emphasis on low cost production.

These materials will support high speed, roll-to-roll integration and large area printable electronics to address the IoT opportunities. Necomada also aims to deliver a supply chain that enables future commercialisation to a range of industries, including apparel, healthcare, printing, domestic appliances, smart packaging, and fast-moving consumer goods.

Initial target applications for demonstrative products include Near Field Communication (NFC) and Radio Frequency Identification (RFID) tags.

“PragmatIC is delighted to be working with the world-leading Necomada partners to advance NFC products into the marketplace, based on our proprietary flexible ICs,” said Richard Price, Chief Technology Officer at PragmatIC.

Necomada involves the collaboration of 13 partners: The Centre for Process Innovation (CPI), Henkel Electronic Materials, PragmatIC Printing, Teknologisk Institut, Contitech Elastomer-Beschichtungen, Nanogap Sub-NM-Powder, Thomas Swan, BSH Electrodomesticos Espana, Henkel KGaA, Crown Packaging Manufacturing UK, Fraunhofer FHG, Tyoeterveyslaitos and NXP Semiconductors.

The project will use and build on CPI’s open access pilot facilities at the UK’s National Centre for Printable Electronics to develop hybrid integration systems for printed electronics, as well as new materials development. Hybrid systems combine the strengths of two complimentary technologies: large area electronics to enable flexibility and silicon CMOS ICs for high performance.

This project has received funding from the EU’s Horizon 2020 research and innovation programme.