CEVA and VisiSonics bring 3D spatial audio to the consumer space

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CEVA, s licensor of wireless connectivity and smart sensing technologies, and VisiSonics, a developer of 3D spatial audio technologies, are working together to develop a 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables.

The collaboration combines VisiSonics’ RealSpace 3D audio software optimised for CEVA’s low power audio and sensor hub DSPs together with CEVA’s MotionEngine head tracking algorithms running on its BNO080 9-axis System in Package (SiP). The result, according to the two companies, is a high precision real-time 3D audio solution for System-on-Chip (SoC) vendors, OEMs and ODMs who are looking to provide an iimproved hearing experience for VR, AR and the new generation of motion-aware earbuds where 3D audio enhances the overall user experience.

VisiSonics RealSpace 3D Embedded for Headphones solution incorporates a suite of algorithms that give the listener a feeling of being present in an actual three-dimensional acoustic scene.

This patented and proprietary technology allows one to precisely place auditory objects in virtual auditory space including both ambisonics and object based input, as envisaged in the Dolby Atmos and MPEG-H standards. It also enables injection of personalised head related transfer functions and interfaces with CEVA MotionEngine head tracking to give 'solid' images of the auditory scene.

CEVA’s powerful audio and sensor hub DSPs, including the CEVA-X2, CEVA-BX1, CEVA-BX2 and SensPro family, enable this full suite of algorithms to run seamlessly in an extremely low power footprint.

Commenting Dr. Ramani Duraiswami, CEO, VisiSonics said that b partnering with CEVA it would be possible to, bring the company's RealSpace 3D Audio technology to headsets and hearables powered by CEVA's DSPs. "We can accelerate the adoption of this technology in mobile applications, and bring the power of immersive 3D audio to everyone,” he added.

“VisiSonics’ RealSpace 3D audio technology provides an incredible listening experience and we’re pleased to collaborate with them to further enhance the performance with our audio/sensor hub DSPs and 3D head tracking software,“ said Moshe Sheier, Vice President of Marketing at CEVA. “The use of contextually-aware audio for mobile and wearables is set to grow exponentially in the coming years on the back of 5G, and together with VisiSonics, we can help OEMs and ODMs leverage high precision 3D audio in their hearables to ride this wave.”

CEVA's audio and sensor hub DSPs are optimised for sound processing applications ranging from always-on voice control up to multiple sensors fusion. They have been designed to tackle multi-microphone speech processing use-cases, high quality audio playback and post-processing, and on-device sound neural network implementations.

In addition, a large 3rd party ecosystem of audio/voice software, hardware and development tools companies have optimised their solutions for CEVA DSPs, for a wide array of use cases and applications.