Cadence upgrades pcb design package

Cadence Design Systems has introduced the latest version of its Allegro pcb and IC packaging technology, said to provide a significant increase in both productivity and predictability across silicon, SoC and system development.

The electronic design specialist says the Allegro 16.5 will enable users to access advanced features on demand for specific design tasks, optimising total cost of ownership. New technologies include advanced miniaturisation capabilities, integrated power delivery network analysis, ddr3 design-in kit, bolstered co design features and flexible team design enablement to address global designer productivity. "Coming on the first anniversary of the announcement of the EDA360 vision, our Allegro 16.5 release strengthens the connection between Silicon, SoC and system realisation - the three key tenets of EDA360," said John Bruggeman, pictured, senior vice president and cmo of Cadence. "We have leveraged our leadership in pcb and IC package design to drive a true end to end flow across all product creation disciplines, which speeds time to market while improving productivity and profitability for our customers."