Dialog Semiconductor has licensed Cadence's Tensilica HiFi Audio/Voice DSP IP to create new audio solutions for its connectivity products.
"Sound quality, performance and low power architecture are critical contributors to our reputation," said Mark Tyndall, vice president of corporate development and strategy at Dialog. "The Cadence Tensilica HiFi Audio/Voice DSP delivers in all these areas and has a comprehensive software partner ecosystem, which is essential for the connectivity and portable device markets we serve." The IP is said to combine best capabilities of dsps and cpus while delivering 10 to 100X the performance. This is because it can be optimised using automated design tools to meet specific signal processing performance targets. Jack Guedj, corporate vice president of R&D at Cadence, commented: "By selecting our HiFi audio/voice DSP IP core, Dialog will be able to continue its tradition of offering its customers top quality ics for their next generation wireless connectivity and other portable devices, including smartphones and tablet pcs.