Breeding success: Embedded World 2012 preview

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This year's embedded world exhibition and conference takes place in Nuremberg from 28 February to 1 March. The tenth running of the event is set to be bigger and more international than ever, according to the organiser. Exhibition manager Alexander Mattausch noted that exhibitor numbers are 23% up on the same time in 2011, with appreciable growth in the number of international companies.

Because of its success, the exhibition is moving to larger halls. Mattausch said: "Embedded world will take place in new 'workrooms'. The new location ensures a compact layout on one level and excellent access between the conferences and exhibition activity. The excellent figures show us that the new rooms have been well accepted by exhibitors." The exhibition will be accompanied by a conference focusing on topics such as: ARM Cortex architectures; multicore; cryptography and embedded security; managing embedded system development and life cycle; software development and debug methods; internet technology and M2M; and low energy embedded systems. There will also be an electronic displays conference and, for the fourth year, visitors will be able to find out more about M2M communications in the M2M area. For more information on the event and to register in advance, go to www.embedded-world.de/en. Arrow Electronics' engineering and embedded computing integration services will be showcased on two stands. One stand will show how the company can support developers from the identification of new applications to the concept phase and development of the solution. In particular, this stand will emphasise areas such as functional safety in industrial automation, motion control, led lighting and memory solutions. Meanwhile, the other stand will demonstrating how Arrow can 'bring it all together'. These services include end to end solutions, design engineering, supply chain management, global logistics and post manufacturing solutions. Arrow: visit www.arroweurope.com Hall 4A-206 Hall 5-405 Visitors to the Avnet Memec stand will see new solutions for smart innovation from the world's best semiconductor companies. There will be three key presentation areas, including: multisupplier technology focused demonstrations; a focus area dedicated to products from PLX Technology, Marvell, Intersil and Echelon; and the Maxim Tech Lounge. PLX Technology will show its PCI Express silicon, as well as USB3.0 and 10Gbit Ethernet devices. Marvell will showcase its ARM processing solutions, including multicore devices running at up to 2GHz, while Intersil will highlight signal chain devices that support high accuracy conversion, plus power management solutions. Finally, in the Echelon focus area, visitors will be able to see smart building and utility focused demonstrations. Avnet Memec: visit www.avnet-memec.eu Hall 4-122 Avnet Abacus will make its debut at Embedded World, demonstrating embedded power solutions for a range of applications. The company will also have CAN-bus interface and sensor products on display. Emerging markets are said by the company to require more than a single component approach. In solid state lighting, for example, it is important to support leds with the latest, high reliability driver circuitry, passives and connectors. When it comes to energy harvesting, designers need to see a complete systems picture before deciding on which technology is most appropriate. Alan Jermyn, Avnet Abacus' vp of European marketing, said: "Embedded World 2012 is the perfect opportunity for us to showcase our technical and applications capabilities and we will also take the opportunity to feature recently launched products." Avnet Abacus: visit www.avnet-abacus.eu Hall 1-249 Power management solutions specialist Enpirion will showcase its latest high density PowerSoC family under microscopes to display its inner workings, including miniaturised inductors, high frequency fets and next generation packaging methodologies. Benefits claimed for the approach include: high power density; simplified design flow; reduced cost; high efficiency; and high reliability. "The embedded arena is a very important sector for Enpirion," said Mark Cieri, director of marketing and business development. "Visitors will see for themselves how our PowerSoC solutions optimise power management, without the compromise traditionally expected with discrete products." Enpirion: visit www.enpirion.com Hall 4-429 Amongst the highlights to be seen at the Fujitsu stand will be the new 32bit risc FM3 microcontroller. With dual Ethernet interfaces, the part is aimed at industrial and embedded applications. Visitors will also see scalable solutions for the automotive market, including the FCR4 product family for hybrid clusters and the 16FX mcu product family for demanding control applications. The FM3 family, based on the ARM Cortex-M3 core, offers CAN and USB2.0 functionality and supports the industry's first two channel Ethernet MAC. Designed for processing intensive and communications applications, FM3 products are suited to use in a range of networked applications. The 16FX mcu range is based on Fujitsu's 16FX cpu. Delivering up to 20MIPS, this cpu has been proven in many automotive and industrial applications. Other automotive solutions include the Indigo2 and Emerald graphic controllers, as well as the FR81S product family. The latter parts are designed for automotive body and comfort applications and offer extended features for diagnosis and control of load switching, as well as support for functional safety. Fujitsu: visit www.emea.fujitsu.com/semiconductor Hall 4-228 Infineon will launch the XMC – cross market microcontroller – family, said to be suitable for a range of industrial applications. This range will, says the company, close the performance gap between the 16bit XE166 and the 32bit TriCore families. XMC4000 devices are designed to enable scalable compatible solutions with a high degree of software reusability. There are five series within the family, differing in terms of frequency, memory capacity, peripheral functions and I/O count. According to Infineon, XMC4000 parts integrate a powerful cpu subsystem, dsp functionality, a floating point unit, fast flash memory, large sram and extended peripheral functions. One of the first devices to be launched is the XMC4500 series, which offer a 120MHz cpu, up to 1Mbyte of embedded flash and 160kbyte of ram. Visitors to the stand will also see DAVE 3, Infineon's integrated development environment supporting application oriented software development. Infineon: visit www.infineon.com Hall 4-142 Test products for applications ranging from high speed serial data and embedded systems to energy efficient designs and rf test, will be seen at Tektronix' stand. Hands on demonstrations will be available, along with technical advice to help solve individual test and measurement challenges. Trevor Smith, technical marketing manager, said: "We are looking forward to showing off new products at the show, with the help of our distribution partners Elektronik-Kontor and CalPlus, who will be on-hand to answer questions and give product demonstrations." Amongst the highlights, says the company, are the MDO4000 mixed domain scope series, the MSO3000 bench scopes and the mid range MSO/DPO5000 mixed signal scopes. Tektronix: visit www.tektronix.com Hall 4-205 USB solutions specialist Future Technology Devices International is adding to the range of I/O application boards for its Vinco development module. New Vinco Touch Key shield mates, along with the Vinco motherboard, providing full touch pad functionality, says the company. The shield has eight capactive sensing touch keys, a set of four push buttons and five GPIO controlled leds. The touch keys can pass input data to the Vinculum-II USB host/device controller on the Vinco module via the i2c bus, where it can be processed by 16bit microcontroller. Access to the Vinco pwm interface is also available on the header pins. FTDI: visit www.ftdichip.com Hall 4A-322 Green Hills Software has recently made a major upgrade to its INTEGRITY real time operating system and will be demonstrating the performance, communication and ease of use features in INTEGRITY 11. The rtos includes a new, highly optimised communications mechanism called GIPC (Green Hills IPC), said to be five times faster than Linux AF_LOCAL sockets. Together with its support for POSIX APIs and higher level middleware such as DDS and CORBA, INTEGRITY provides developers with a range of high performance communications mechanisms. When integrated with MULTI 6, INTEGRITY 11 takes advantage of faster build speeds and improvements in code size and speed delivered by the Green Hills compiler. The combination of INTEGRITY 11 and MULTI 6 is said by Green Hills to represent the 'state of the art' in rtos development tool integration. Green Hills Software: visit www.ghs.com Hall 4-325 Pride of place on the Adlink stand goes to the cPCI-3970 series, said to be the first 3U CompactPCI PlusIO compatible processor blade in the company's portfolio that supports high speed serial point to point connections. The blades are equipped with the latest quad and dual core second generation Intel Core i7/i5 processors and the Intel QM67 Platform Controller Hub. The high performance solution is targeted at applications in the industrial control and automation, transportation and medical markets that require enhanced graphics capabilities and high speed I/O interconnects. Adlink will also show the Smart Panel series of products designed to provide an 'all in one' concept to panel computing, with applications including factory automation, transportation, multimedia navigation, advertising, interactive kiosks and medical care. Adlink: visit www.adlinktech.com Hall 1-532 Analog Devices will have a number of focus areas on its stand, including: interfacing fpgas to its products; interface and isolation; microcontroller/rf; process control; and design resources and support. At the interface area, the company will show a range of MEMS sensors and data conversion devices connected to and controlled by an Avnet Xilinx Spartan-6 fpga LX9 MicroBoard and the Arrow Altera Cyclone IV BeMicro software development kit. When it comes to design support, the stand will highlight Circuits from the Lab reference circuits, while European Customer Interaction Centre staff will be available to provide live technical support. Analog Devices: www.analog.com Hall 4-234 Highlights on Rutronik's stand include an electric car from Tesla and an Arquicity led street lamp with automatic brightness adjustment, developed by Rutronik in collaboration with Osram Opto Semiconductors and solid state lighting specialist Arquiled. As an example for the industrial field, Rutronik will be demonstrating the intelligent energy controlling system from econ solutions, which provides industrial companies with transparency about every point of energy consumption. Product and application engineers from the company's six vertical market teams and from its product divisions will be available. Rutronik: visit www.rutronik.com Hall 1-138 High performance USB mcus for a variety of embedded applications will be amongst the stand out displays on the Silicon Laboratories' stand. Visitors will also see ultra low power mcus and wireless mcus targeting green energy, home automation and security systems; automotive mcus for body electronics; and the company's latest development platforms and integrated development environments. Demonstrations will include new mixed signal solutions and easy to use development tools that enhance embedded design productivity Visitors will also be able to 'test drive' an automotive motor control reference design tested to AEC-Q100 specifications and operating at up to 125°C. Silicon Laboratories: visit www.silabs.com Hall 4A-211