Engineering publications brought to you by Mark Allen

Distribution

Consortium to develop world class NFC packaging capability for the UK

Gallium oxide could replace silicon

Lawrence Livermore and IBM collaborate to build brain-inspired supercomputer

Next generation fibre optic connector outperforms industry standard

Zigzag edges could make graphene the material of choice in spintronic devices

Reichelt looks to shake-up UK electronics market

As MCUs head to the leading edge, will NVM oust flash?

Tektronix unveils 1GHz optically isolated measurement system

Guard against fakes, says ESCO

5G is demanding a new type of architecture; one disruptive solution could be a Flat Distributed Cloud architecture

JEDEC tackles counterfeiters with new standard

Latest PowerVR Graphics SDK includes support for Vulkan API