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Renesas to outsource 40nm mcu manufacture to TSMC

SPICE simulator speeds analogue and rf designs

Efficient GPGPU programming with OpenCL

27,000 jobs to go at Hewlett-Packard

Grenoble based collaboration to research 3d ics and photonics integration

Quad dsp audio processor to help oem product differentiation

Complexity could see power management chips becoming the next integration platform within mobile phones

Electric Imp brings ‘Internet of Things’ to the home

Power modules shrink pcb size by up to 70%

Silicon Labs buys Ember, targets ‘internet of things’

AMD launches R series and targets graphics intensive applications

ARM approves Feabhas as training centre