Engineering publications brought to you by Mark Allen

Consumer

High security RFID component provides anti counterfeiting solution

Kinetis MCU is ‘smaller than a golf ball dimple’

Embedded World 2014

Bendable, stretchable optical interconnect developed

Google smartphone maps the world in 3D

Spansion introduces high data rate memory interface

Electronics Leaders Group signs up to Kroes’ action plan

Nujira provides envelope tracking efficiency results for TD-LTE

Exciting times for IoT?

Seminar tackles counterfeit components in the supply chain

Partners demonstrate ‘trail blazing’ DSP based on FD-SOI process

ARM targets mid range smartphones with new Cortex core