Engineering publications brought to you by Mark Allen

Consumer

Morse Micro Wi-Fi HaLow technology receives Matter certification

ST/Qualcomm developed Bluetooth/Wi-Fi modules go into mass production

xMEMS extends 'fan-on-a-chip' platform to SSDs

xMEMS delivers first in-frame active thermal management for AI-driven wearables

Elliptic Labs and Ceva announce collaboration to enable smarter edge devices

Kardome and LG look to transform voice user interfaces with spatial hearing AI

MediaTek’s Dimensity 9400e mobile platform provides enhanced AI and connectivity

xMEMS unveils thinnest speaker to date, engineered for wearables

Consumer Products

ST’s off-line high-voltage converters target consumer and lighting applications

Ceva launches MotionEngine Hex delivering 6-DOF motion tracking and intuitive control

ST develops advanced 1600 V IGBTs for cost-sensitive appliance markets

Consumer Features

Bring AI to the device level with TinyML optimisations

Smart living made simple

AI - Here, there and everywhere