Engineering publications brought to you by Mark Allen

Semiconductors

TI launches new dsp/ARM combo processors

Intel to spend $8bn on 22nm fabs in the US

High performance vector dsp for 4G applications

NXP targets power consumption with new mcu range

TI buys 200mm Chinese fab

Lattice tackles power and board management

Converters cut consumption

26 into 1 does go

Maxim embarks on new development phase

MCU targeted at energy management systems

Power Integrations Seminar

Xilinx updates ISE Design Suite to support AMBA 4 AXI4 spec