Engineering publications brought to you by Mark Allen

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Optical chip blends silicon and erbium, handles 170Gbit/s

Toshiba, Panasonic team up for Bluetooth module

Technology developments are making fibre more cost effective

Pushing packet performance: How IP networks are handling ever more data

GreenPeak chip turns set top box into smart home hub

Layerscape to provide ‘flexibility and scalability’

Freescale launches basestation SoC for metrocells

Freescale upgrades QorIQ processor range

Mindspeed unveils ARM Cortex-A9 communications processor

Design challenges of implementing USB into next generation portable communications hardware

Deutsche Telekom launches M2M Marketplace

CAN transceivers offer improved robustness and increased efficiency