Engineering publications brought to you by Mark Allen

Neil Tyler

Electromechanical

Wall mounting kit for EVOTEC enclosures

Interconnection

Smiths Interconnect launches SpaceNXT Ku series of band circulators and loads

Research Design

Imec first to stack FinFETS with 45nm fin pitch using sequential 3D integration

Research Design

CEA-Leti extends 300mm wafer line

Automotive

Siemens acquires COMSA

Ultrahaptics raises £35 million in Series C fundraising

Embedded & Programmable

Microchip unveils new class of SoC FPGA

Wireless Technology

u-blox partners with Arvento to develop multi-purpose people and asset tracker

Automotive

Advanced image sensors from STMicroelectronics

Test & Measurement

Keysight Technologies bolsters support services

Passive Components

Molex introduces Coeur CST high-current interconnect system

Board Level Design

CEA-Leti and Silvaco look to develop innovative SPICE models