Engineering publications brought to you by Mark Allen

Neil Tyler

CPUs

FTDI launches latest series of multi-channel USB interface ICs

Test & Measurement

RS introduces selection of T&M kits from Keysight

CPUs

New DSP architecture unveiled by CEVA

Board Level Design

Jiva Materials completes funding round to deliver fully recyclable PCBs

Automotive

100V N-channel power MOSFET for automotive applications

Embedded Systems

TASKING expands strategic Infineon partnership

Communications Hardware

Marvell launches OCTEON fusion wireless infrastructure processors

Aerospace

Rakuten and Vodafone invest in AST & Science’s Space Venture to extend mobile coverage

Displays

Xilinx launches Alveo U25 SmartNIC platform

Samsung starts building R&D centre in Vietnam

Board Level Design

A current map for improving circuit design

CPUs

NXP to leverage Fraunhofer’s MPEG audio SDK