Engineering publications brought to you by Mark Allen

Neil Tyler

Board Level Design

Zuken's E3.series 2021 looks to increase user efficiency

Power

congatec launches 20 Computer-on-Modules with 11th Gen Intel Core processors

Displays

Nexperia releases 80V and 100V ASFETs

Automotive

eSync Alliance accelerates automotive OTA development

Embedded Systems

IHLP commercial inductor offers high temperature operation

Automotive

Infineon hit by chip shortages

Displays

Marvell Tech to acquire Innovium for $1.1bn

Manufacturing

SMART Modular announces DDR5 industrial grade modules

Consumer

Spectricity raises €14m Series B funding for hyperspectral sensing

5G hesitancy found among European businesses

Embedded Systems

First COM Express Module to feature Intel Core, Xeon and Celeron 6000 processors

Research Design

Breakthrough in AI Cloud systems