Textronix announces most comprehensive PCI Express 3.0 test solution

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Tektronix is to showcase the most comprehensive set of physical and protocol layer measurement capabilities for the PCI Express (PCIe) architecture.

The oscilloscope manufacturer will be demonstrating its new PCIe 3.0 solution at PCI-SIG Developers Conference in Israel. According to Tektronix, it builds on the PCIe 1.0 and 2.0 specification test solutions with Serial Data Link Analysis software, providing support for verifying transmitter and channel performance of PCIe 3.0 architecture designs. It also supports for both the PCIe 3.0 base specification and CEM specification measurements. I/O technology includes a new 128/130b encoding scheme and a data rate of 8 GT/s, doubling the interconnect bandwidth over the PCIe 2.0 specification. Based on the same board material (FR4) and connectors as previous generations, the PCIe 3.0 architecture features smaller margins and new jitter measurements required to account for increased signal loss in the channel. "Tektronix' continued engagement in PCI-SIG and support for the PCI Express 3.0 specification helps enable the ecosystem," said Al Yanes, president and chairman, PCI-SIG. "As an early adopter of the PCIe 3.0 specification, we value Tektronix' ongoing contribution to the success of PCIe technology."