Macronix memory to joim Qualcomm Technologies’ modem

Macronix has announced that its NAND multichip package (MCP) memory solution has been adopted and incorporated by Qualcomm Technologies, as a part of the reference design for its LTE Cat. M1/NB-1 chipset, the MDM9206 modem.

“Being incorporated in Qualcomm Technologies’ reference design for its latest LTE MDM9206 modem is an important accomplishment for our MCP solutions,” said Macronix VP of marketing, FL Ni. “The Internet of Things is the next revolution in the mobile ecosystem, and it’s great to be a part of powering the devices of the future.”

The company’s industry-standard MCPs combine RAM and Flash memories into one package. The NAND MCPs are said to offer minimal footprint and power efficiency. In addition, the company claims its product longevity programme brings reliable and sustainable memory support.