Leti and CMP provide multi-project wafer service with integrated silicon oxram

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Leti, a research institute at CEA Tech, and Circuits Multi-Projects (CMP)are offering the world's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

CMP is a service organisation that provides prototyping and low-volume production of ICs and MEMS.

Available on Leti’s 200mm CMOS line, the MPW service provides a comprehensive, low-cost way to explore techniques designed to achieve miniaturised, high-density components.

The service includes Leti’s Memory Advanced Demonstrator (MAD) future mask set with disruptive OxRAM (oxide-based resistive RAM) technology, and Leti’s integrated silicon memory platform which has been developed for backend memories and non-volatility associated with embedded designs. The new technology platform will be based on HfO2/Ti (titanium-doped hafnium oxide) active layers.

Emerging OxRAM non-volatile memory (NVM) is seen as a promising technology to be implemented with classical embedded memory applications on advanced nodes like microcontrollers or secure products, as well as for AI accelerators and neuromorphic computing.

According to Leti, its MAD platform is dedicated to advanced non-volatile memories, and is intended to bring greater versatility and robustness to material and interface assessment, allowing in-depth exploration of memory performance from technology and design perspectives.

The full platform’s highlights:

• 200mm STMicroelectronics HCMOS9A base wafers in 130nm node

• All routing is made on ST base wafers from M1 to M4 (included)

• Leti’s OxRAM memory module is fabricated on top

• One level of interconnect (i.e. M5) plus pads are fabricated in Leti’s cleanroom

“Leti has deep expertise in NVM devices covering flash evolutive solutions and disruptive technologies,” said Etienne Nowak, head of the Leti’s Advanced Memory Lab. “This MPW capability, combined with our Memory Advanced Demonstrator platform, is based on a broad tool box that enables customised research with our partners, and provides a benchmark between different NVM solutions.”

The MPW service looks to address all the key steps of advanced memory development, says Leti. These include material engineering and analysis, developing critical memory modules, evaluation of memory cells coupled with electrical tests, modeling and innovative design techniques to comply with circuit design opportunities and constraints.

This technology offer comes with a design kit, including layout, verification and simulation capabilities. Libraries are provided with a comprehensive list of active and passive electro-optical components.

“CMP has a long experience providing smaller organisations with access to advanced manufacturing technologies, and there is very strong interest in the CMP community in designing and prototyping ICs using this process,” said Jean-Christophe Crébier, director of CMP. “It is an opportunity for many universities, start-ups and SMEs in France, Europe, North America and Asia to take advantage of this new technology and MPW service.”