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NXP announces major benchmark in miniaturisation

NXP Semiconductors has announced a breakthrough in miniaturisation with the launch of its next generation family of low VF Schottky rectifiers with a thickness of just 0.37mm and an outline of 1.6 x 0.8mm.

Targeting the mobile device market, NXP says the DFN1608D-2 (SOD1608) plastic package is the smallest on the market and is capable of carrying a current of up to 1.5A. The device has been released with a portfolio of six Schottky Barrier rectifiers: three 20V ... Read More

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