3D chips ready for Big Data

In a development which could help address the current data processing limitations of today's technology, a team of Stanford engineers has pioneered a scalable 3D computer chip that interconnects logic and memory.

  • 'High rise' 3D chips are ready for Big Data

    In a development which could help address the current data processing limitations of today's technology, a team of Stanford engineers has pioneered a scalable 3D computer chip that interconnects logic and memory.

    The researchers believe that with ...
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  • Qualcomm, EE and Huawei test LTE Category 9

    Huawei, EE and Qualcomm have partnered for an LTE category 9 interoperability trial, claiming to have achieved download speeds of up to 410Mb/s.

    According to the partners, this represents a significant step forward in the industry's attempt to ...
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  • Radical approach brings ‘breakthrough’ in optical communications

    Academics from the University of Southampton's Optoelectronics Research Centre (ORC) have collaborated with Eblana Photonics to develop an approach that enables advanced modulation format signals to be generated by the modulation of laser currents.

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  • £32million for functional materials R&D

    The Engineering and Physical Sciences Research Council (EPSRC) has announced funding for 10 research projects that are expected to develop new and exciting functional materials, as well as accelerate the application of the materials. The projects, which will ... Read More





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