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TE introduces SFP-DD interconnect

TE Connectivity (TE) has extended its small form-factor pluggable (SFP) product portfolio with new, small form-factor pluggable double density (SFP-DD) products for input/output (I/O) interconnects.

The “double density” new cages and surface mount connectors can offer two-channel data transmission, instead of the traditional one-channel in an SFP architecture, which helps data centre systems to enable doubled port density with faster data transfer rates.

Compared to the SFP28/SFP56 product portfolio, these solutions can offer higher density and better signal integrity while freeing up PCB and faceplate space in comparison with QSFP28/QSFP56.

The SFP-DD connectors feature a two-lane interface and can provide data rates up to 28G NRZ and 56G PAM-4 protocols with a roadmap to 112G PAM-4, up to 56 Gbps or 112 Gbps. Both new cages and connectors are backwards compatible to existing SFP products, which can enable easy upgrades to existing SFP series applications.

They have been designed to offer system design flexibility, customisable solutions to support thermal management, cable length and stacked configurations. The SFP-DD interconnect solution can offer superior thermal management with TE’s innovative thermal bridge technology.

Author
Neil Tyler

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http://www.te.com

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TE Connectivity

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