27/08/2019
METCASE is now offering a wider range of standard and customised 19” aluminium enclosures for desktop and portable instrumentation.
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31/07/2019
Abaco Systems has announced a powerful new rugged XMC graphics and video board.
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19/07/2019
SMART-TERMINAL and SYNERGY aluminium enclosures from OKW are now available in custom sizes.
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09/07/2019
Advantech has announced the latest addition to its ARK-1000 series: the ARK-1220, a compact DIN-Rail fanless embedded box PC for industrial and/or outdoor environments.
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01/07/2019
ROLEC is offering three IP 54 modular suspension arm systems for a wide range of industrial electronics applications.
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26/06/2019
Microchip has announced four new 20-output differential clock buffers that exceed PCIe Gen 5 jitter standards for next-generation data centre applications.
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24/06/2019
Silicon Labs has expanded its family of Si539x jitter attenuators with new device options featuring a fully integrated reference, enhancing system reliability and performance while simplifying PCB layout in high-speed networking designs.
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21/06/2019
Mercury Electronics Europe has announced a new range of wide operating temperature crystal oscillators that are intended for use in automotive applications.
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22/05/2019
?CommAgility has announced a new reference platform for LTE UEs (mobile devices), enhanced its existing LTE eNodeB (base station) reference platform, and released a new graphical LTE Management Tool.
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13/05/2019
OKW has launched two adaptors that enable any small plastic enclosure to be mounted on a DIN rail – saving space and speeding up installations.
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09/05/2019
The Silicon Valley start-up, Pre-Switch has announced its CleanWave 200kW silicon carbide (SiC) automotive inverter evaluation system.
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18/04/2019
JPR Electronics is now stocking an extended range of CamdenBoss CNMB DIN-Rail Module boxes .
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17/04/2019
Artesyn Embedded Technologies has announced the latest four-slot case and a new hold-up module for its second generation MicroMP (µMP) series configurable AC-DC power supplies.
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12/04/2019
METCASE is making available its advanced TECHNOMET 19” mini-rack enclosures with a wide range of customisation options.
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05/04/2019
Frequency control specialist, Euroquartz has launched a range of miniature surface mount temperature-compensated crystal oscillators (TCXO) offering very low current consumption in real time clock applications.
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04/04/2019
ZF has introduced a reference design for an Energy Harvesting Bluetooth Low Energy Switch in a partnership with ON Semiconductor.
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29/03/2019
Cortex-M based microcontrollers are one of the most popular choices for IoT clients because of their low power consumption and high performance. The industry leading Keil MDK-ARM toolchain now includes support for all the leading IoT cloud based services.
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05/03/2019
OKW has added a new holder to its STYLE-CASE range of ergonomic handheld enclosures.
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04/03/2019
RS Components (RS) has introduced the Gen4 Series of integrated TFT LCD modules and related starter packs from embedded graphics specialist 4D Systems.
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26/02/2019
At Embedded World 2019, Cypress Semiconductor has announced a new line of its PSoC 6 microcontrollers (MCUs) designed to give Internet of Things (IoT) designers confidence in the security of their applications.
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26/02/2019
Following on from its Bluetooth Low Energy (BLE) modules, Insight SiP, the specialist in ultra-miniature RF modules, has launching the ISP4520 series of modules at this year's Embedded World.
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25/02/2019
Pixus Technologies, a provider of embedded computing and enclosure solutions, has released new OpenVPX backplanes for 6U applications
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20/02/2019
Infineon Technologies has introduced smart IPM motor controllers which feature full hardware and software integration needed for BLDC motor drives of up to 80W without heatsink.
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18/02/2019
Rugged connector and component manufacturer Bulgin has launched a smart connector which is designed for easy pairing of devices and connectors, real-time connection status sensing and electronic device serialisation.
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06/02/2019
Melexis has unveiled a new version of its far infrared (FIR) thermal sensor array. The device has lower thermal noise compared to the current MLX90640, an increased refresh rate of 64 Hz and an elevated operating temperature up to 125 °C.
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