13/05/2019
OKW has launched two adaptors that enable any small plastic enclosure to be mounted on a DIN rail – saving space and speeding up installations.
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09/05/2019
The Silicon Valley start-up, Pre-Switch has announced its CleanWave 200kW silicon carbide (SiC) automotive inverter evaluation system.
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18/04/2019
JPR Electronics is now stocking an extended range of CamdenBoss CNMB DIN-Rail Module boxes .
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17/04/2019
Artesyn Embedded Technologies has announced the latest four-slot case and a new hold-up module for its second generation MicroMP (µMP) series configurable AC-DC power supplies.
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12/04/2019
METCASE is making available its advanced TECHNOMET 19” mini-rack enclosures with a wide range of customisation options.
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05/04/2019
Frequency control specialist, Euroquartz has launched a range of miniature surface mount temperature-compensated crystal oscillators (TCXO) offering very low current consumption in real time clock applications.
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04/04/2019
ZF has introduced a reference design for an Energy Harvesting Bluetooth Low Energy Switch in a partnership with ON Semiconductor.
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29/03/2019
Cortex-M based microcontrollers are one of the most popular choices for IoT clients because of their low power consumption and high performance. The industry leading Keil MDK-ARM toolchain now includes support for all the leading IoT cloud based services.
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05/03/2019
OKW has added a new holder to its STYLE-CASE range of ergonomic handheld enclosures.
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04/03/2019
RS Components (RS) has introduced the Gen4 Series of integrated TFT LCD modules and related starter packs from embedded graphics specialist 4D Systems.
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26/02/2019
At Embedded World 2019, Cypress Semiconductor has announced a new line of its PSoC 6 microcontrollers (MCUs) designed to give Internet of Things (IoT) designers confidence in the security of their applications.
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26/02/2019
Following on from its Bluetooth Low Energy (BLE) modules, Insight SiP, the specialist in ultra-miniature RF modules, has launching the ISP4520 series of modules at this year's Embedded World.
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25/02/2019
Pixus Technologies, a provider of embedded computing and enclosure solutions, has released new OpenVPX backplanes for 6U applications
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20/02/2019
Infineon Technologies has introduced smart IPM motor controllers which feature full hardware and software integration needed for BLDC motor drives of up to 80W without heatsink.
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18/02/2019
Rugged connector and component manufacturer Bulgin has launched a smart connector which is designed for easy pairing of devices and connectors, real-time connection status sensing and electronic device serialisation.
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06/02/2019
Melexis has unveiled a new version of its far infrared (FIR) thermal sensor array. The device has lower thermal noise compared to the current MLX90640, an increased refresh rate of 64 Hz and an elevated operating temperature up to 125 °C.
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22/01/2019
STMicroelectronics’ STHVDAC-253C7 digital controller for tunable capacitors, such as ST’s STPTIC family, has been designed to shrink the size, bill of materials (BoM), and power consumption of antenna-tuning circuits for stabilising smartphone RF performance.
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11/01/2019
BCL Distribution has expanded its T Series enclosures of small multi-purpose boxes.
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09/01/2019
METCASE has launched a sloping front version of its advanced TECHNOMET desktop instrument enclosures. TECHOMET SL is designed for applications including medical and laboratory instruments, test and measurement, industrial control and communications.
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05/12/2018
OKW has launched a new suspension element for its EVOTEC designer table-top enclosures, enabling them to be wall mounted.
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23/11/2018
The prototype specialist and PCB manufacturer Beta LAYOUT has simplified the online ordering process for printed circuit boards.
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07/11/2018
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Microchip has unveiled what it claims is the industry’s smallest MEMS clock generator.
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10/10/2018
New mountable stations for OKW’s BODY-CASE wearable enclosures enable multiple units to be charged at once.
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26/09/2018
Renesas Electronics has announced the Synergy AE-CLOUD2 kit, a hardware and software reference design that allows embedded developers to evaluate cellular connectivity options and build LPWA cellular IoT applications.
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25/09/2018
Mouser is now stocking the AmbiMate sensor module MS4 development kits from TE Connectivity (TE). The development kits enable global engineering and development teams to build prototypes and evaluation boards for systems incorporating TE’s AmbiMate MS4 Series sensor modules.?
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