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Space qualified interconnect

Smiths Interconnect has released of its new NXS Series, an ultra-high density interconnect specifically designed and tested for critical space flight applications.

With space satellites moving away from RF analogue-based payloads providing low-speed telecommunication signalling, to a new Digital Transparent Processor architecture for high throughput satellites there is increased demand for rugged and higher speed connectivity.

NXS forms the interconnect backplane that enables a scalable satellite design using as many or as few “modular digital processors” as required, at the same time ensuring signal integrity and high resistance to shock.

The NXS Series has been designed to provide a compact, solderless PCB mounted connector that can be placed and replaced with very low risk to the board.

The NXS Series is qualified to rigorous testing and performance criteria: ESCC 3401, ESCC 3402, ECSS-Q-ST-70C, ECSS-Q-ST-70-02, ECSS-Q-ST-70-08C, ECSS-Q-ST-70-38C and ECSS-Q-70-71.

Equipped with the micro Hypertac Hyperboloid contact technology, the series can withstand data rate application up to 10 Gbps requirements per channel, including extreme levels of vibration, shock and climatic testing above 2100G.

The NXS Series also comes in a robust design/construction with 4 or 12 high speed quadrax (dual-twinax) modules. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials.

Author
Neil Tyler

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