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New congatec modules with 11th Gen Intel Core processors

congatec has introduced six new Computer-on-Modules with 11th Gen Intel Core processors for extended temperature range.

Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments.

Typical use cases for the new industrial-grade COM-HPC and COM Express modules can be found in any kind of rugged applications, outdoor edge devices and in-vehicle installations, which increasingly leverage embedded vision and artificial intelligence (AI) functions. Typical verticals are industrial automation, railway and transportation, and smart infrastructure including mission critical applications.

Based on Tiger Lake SoCs, the modules offer significantly greater CPU performance and nearly 3x higher GPU performance, along with state-of-the-art PCIe Gen4 and USB4 support.

The most demanding graphics and compute workloads benefit from up to 4 cores, 8 threads and up to 96 graphics execution units for massive parallel processing throughput in an ultra-rugged shape. The integrated graphics can be used as parallel processing unit for convolutional neural networks (CNN) or as an AI and deep learning accelerator.

Using the Intel OpenVINO software toolkit that includes optimised calls for OpenCV, OpenCL kernels, and other industry tools and libraries, workloads can be extended across CPU, GPU and FPGA compute units to accelerate AI workloads, including computer vision, audio, speech, language, and recommendation systems.

The TDP is scalable from 12W to 28W, enabling immersive 4k UHD system designs with passive cooling only. The performance of the ultra-rugged conga-HPC/cTLU COM-HPC module and the conga-TC570 COM Express Type 6 module has been made available in a real-time capable design and also includes real-time hypervisor support from Real-Time Systems for virtual machine deployments and workload consolidation in edge computing scenarios.

The package includes rugged passive cooling options, optional conformal coating for protection against corrosion due to moisture or condensation, a list of recommended carrier board schematics and suitable components for the extended temperature range for highest reliability.

This technical feature set is complemented by a comprehensive service offering that includes temperature screening, high speed signal compliance testing along with design-in services and all training sessions required to simplify the use of congatec’s embedded computer technologies.

Author
Neil Tyler

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