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Latest POL module series looks to address power challenge of advanced ICs

CUI has introduced a high current digital POL family designed specifically to address the power requirements of advanced integrated circuits. The NDM3Z-90 is a non-isolated module outputting 90A in ultra low-profile vertical and horizontal packages.

The series delivers benchmark power levels while incorporating a range of advanced digital features, including programmable output range, active current sharing, voltage sequencing, voltage tracking, synchronisation and phase spreading, programmable soft start and stop, as well as a host of monitoring capabilities.

The devices uses Intersil's ZL8801 ChargeMode Control technology, allowing the modules to balance the trade offs between dynamic performance and system stability on a continuous basis. With this feature, designers can avoid building-in margins to account for factors such as component ageing, manufacturing variations and temperature.

Efficiency peaks at 91.4% at 12V DC in to 1V DC out at 50% load. Efficiency remains high up to full load at 88.7%. To address the growing sensitivity to transient load steps in today's ICs, performance has been maximised using Chargemode technology, which allows the module to respond to a transient load step in one switching cycle. Four modules can be connected in parallel to output up to 360A.

The NDM3Z-90 is designed to meet the 'teraAMP' standard for high current digital POL modules recently announced by the Architects of Modern Power (AMP) Group.

The NDM3Z-90 series is available with an input range of 7.5 to 14V DC and a programmable output range of 0.6 to 1.8V DC. All digital features will be dynamically programmable via PMBus commands or through CUI's Novum ACE GUI. The 90A family is available in two compact through-hole configurations, a vertical version measuring 51 x 9.5 x 19mm and a horizontal version measuring 51 x 19 x 10mm. For added flexibility during the development process, the modules are footprint nested to accommodate dual layout needs in the event that design requirements change.

Author
Neil Tyler

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http://www.cui.com

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CUI Inc

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