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Fully encapsulated 50A digital power module from Intersil

Intersil has unveiled the ISL8272M, its first 50A fully encapsulated digital DC/DC PMBus power module. The device is a complete step down power supply that delivers up to 50A from industry standard 12V or 5V input power rails. Four modules can be combined to provide up to 200A.

The ISL8272M can provide point-of load conversions for advanced FPGAs, ASICs, processors and memory in space-constrained and power-dense telecom and datacom applications and is well suited for high-end instrumentation, industrial and medical equipment. Used in conjunction with Intersil's PowerNavigator graphical user interface (GUI), the device simplifies system power conversion and configuration, while speeding design time.

As the complexity and performance of the latest FPGAs and processors used in wired, wireless and cloud computing systems is driving up the number of voltage rails, so this increased complexity requires a higher level of system intelligence and advanced digital power management, including telemetry and system monitoring, to ensure 99.999% uptime.

The ISL8272M's digital control technology provides precise sequencing and system monitoring through the PMBus interface. The ChargeMode control architecture enables compensation-free design that keeps the device stable regardless of output capacitor changes due to temperature, variation or aging. Competitive voltage-mode control power modules often require designers to perform complex calculations, stability analysis and build a compensation network using 4-5 discrete components. The ISL8272M's ChargeMode control loop also provides a single clock cycle fast transient response to output current load steps common in FPGAs and DSPs processing power bursts.

The 50A ISL8272M relies on Intersil's fourth generation digital controller family and expands on the existing 25A ISL8270M and 33A ISL8271M digital power modules, giving customers an easy migration path to higher current power rails. In addition, Intersil's family of fully encapsulated power modules is compatible with all industry pick and place equipment for full manufacturing automation.

Author
Neil Tyler

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