08/09/2020
Analog Devices (ADI) has introduced a full audio system that features the SHARC Audio Module (SAM) for the creation of digital audio devices, including audio FX processors, multi-channel audio systems, MIDI synthesisers, and other DSP-based audio systems.
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17/06/2020
Alpha and Omega Semiconductor has introduced the AOZ676xDI series of high switching frequency and simple-to-use synchronous buck regulators.
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21/05/2020
System-of-systems is a collection of systems, each with a specific function that need to work together.
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15/05/2020
Vicor has announced a ChiP-set that's been developed for high performance GPU, CPU, and ASIC (“XPU”) processors powered directly from 48V.
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20/04/2020
BittWare, a Molex company, and a supplier of enterprise-class FPGA accelerator products, has announced the introduction of the TeraBox 200DE edge server.
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15/04/2020
Mouser Electronics is now stocking the Hello FPGA Kit from Microchip - an entry-level platform developed for end users with low to medium experience with field-programmable gate arrays (FPGAs).
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31/01/2020
Renesas has announced what is says is the industry’s first single-chip synchronous buck and low dropout (LDO) regulator targeting low-power FPGAs, DDR memory and other digital loads for spaceflight payload applications.
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07/01/2020
STMicroelectronics has revealed a LoRa system-on-chip (SoC) for connecting smart devices to the Internet of Things (IoT) using long-distance wireless connections.
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14/11/2019
Advanced Thermal Solutions (ATS) is providing a family of ultra-high performance heat sinks for cooling high powered CPUs, GPUs, FPGAs and AI processors.
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23/10/2019
Melexis has launched the MLX90821, a relative pressure sensor IC designed for measuring very low pressures in automotive applications.
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26/06/2019
Microchip has announced four new 20-output differential clock buffers that exceed PCIe Gen 5 jitter standards for next-generation data centre applications.
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24/06/2019
Silicon Labs has expanded its family of Si539x jitter attenuators with new device options featuring a fully integrated reference, enhancing system reliability and performance while simplifying PCB layout in high-speed networking designs.
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21/05/2019
?CEVA has announced the availability of its CEVA-SLAM software development kit (SDK), aimed at streamlining the development of Simultaneous Localisation and Mapping (SLAM) enabled products.
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14/03/2019
Microchip has unveiled dual- and single-core dsPIC33C Digital Signal Controllers (DSCs) with more options to meet changing application requirements across memory, temperature and functional safety.
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13/03/2019
The LPS33W is a water-resistant MEMS pressure sensor from STMicroelectronics, that combines chemical compatibility, stability, and accuracy for use in a wide range of applications.
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26/11/2018
Concurrent Technologies has launched the SY TR2/525, a 3U VPX development system complete with an 8 or 12-core computing board that has a direct PCI Express link to four slots for additional peripheral boards.
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26/09/2018
Microchip’s new family of dsPIC33CK 16-bit Digital Signal Controllers (DSC) aims to provide system designers with Digital Signal Processing (DSP) power, together with the design simplicity of a microcontroller (MCU).
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20/08/2018
Analog Devices has unveiled the Power by Linear LTM4686, a dual 10A or single 20A ultrathin step-down µModule regulator with a PMBus interface.
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08/05/2018
Vayyar Imaging has announced the launch of what it is calling the “world’s most advanced” System on a Chip (SoC) for mmWave 3D imaging that integrates an unprecedented number of transceivers and an advanced DSP to create a high-resolution contour with high accuracy.
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21/03/2018
Arrow Electronics has extended its Arrow Renesas IoT Synergy (ARIS) platform for developing IoT devices with the ARIS-EDGE-S3.
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08/02/2018
A dual 10A or single 20A output, step-down µModule point-of-load regulator from 5V or 12V input supply rails has been announced by Analog Devices.
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31/01/2018
Two fully encapsulated digital DC/DC PMBus power modules have been announced by Renesas Electronics, which it claims deliver the highest power density and efficiency in their class.
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18/01/2018
An integrated point-of-load (IPOL) family from Infineon Technologies is said to combine high power density with ease of use.
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18/01/2018
Xilinx has announced the availability of the automotive qualified Zynq UltraScale+ MPSoC family, enabling the development of safety critical ADAS and Autonomous Driving Systems.
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05/12/2017
Allegro MicroSystems Europe has introduced 0° to 360° angle sensor ICs that are able to provide contactless high-resolution angular position information based on magnetic Circular Vertical Hall (CVH) technology.
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