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EasyPACK 2B EDT2 power module

Infineon Technologies has introduced the automotive qualified EasyPACK 2B EDT2, a flexible and scalable half-bridge power module.

Depending on inverter conditions, this 750V device can reach a maximum power of up to 50kW and 230 A rms. With its featured specs, the module is optimised for inverter applications in hybrid and electric vehicles.

With the introduction of the EDT2 (Electric Drive Train) technology in this package and full automotive qualification, Infineon is looking to expand the application range of the module family to include traction inverters. The key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip ensures significantly lower losses than current products on the market and even outperforms Infineon's previous chip generation by 20 percent.

Another feature of the EasyPACK is the plug-and-play approach, which simplifies module integration. In addition, compared to classic through-hole discrete packages as well as the HybridPACK 1, soldering of the pins is no longer required. Infineon's PressFIT contact technology enables a reduction in mounting time.

Because of the size of the package size, three EasyPACK 2Bs require 30 percent less surface area than a HybridPACK 1. For this reason they offer not only a very compact but also a cost-effective design.

The EasyPACK 2B EDT2 is fully qualified to the AQG324 standard.

Neil Tyler

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