20/04/2020
BittWare, a Molex company, and a supplier of enterprise-class FPGA accelerator products, has announced the introduction of the TeraBox 200DE edge server.
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20/04/2020
Neousys Technology, a provider of rugged embedded systems, has announced its IGT-30 industrial IoT gateway series.
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16/04/2020
Diodes has announced the industry's first DisplayPort 2.0 (UHBR10) compliant 4-lane, 2:1 active switch with multiplexer and ReDriver.
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26/03/2020
??RS Components (RS), has introduced a low-cost, next-generation data-acquisition system that offers the ability to quickly and dynamically sample more signals simultaneously.
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25/03/2020
TE Connectivity (TE) has launched its new STRADA Whisper cable receptacles, which can allow engineers to start designing for up to 112G PAM-4 data rates in servers, switches and routers.
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17/03/2020
STMicroelectronics has launched a Smart Gateway Platform (SGP) that provides a development tool for prototyping automotive Smart-Gateway and Domain-Controller applications.
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16/03/2020
Blu Wireless has announced the availability of its multi-gigabit high-speed wireless evaluation kit.
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11/03/2020
Renesas Electronics has introduced a next-generation wideband mmWave synthesizer with a unique set of features that have been optimised for 5G and broadband wireless applications.
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10/03/2020
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Emerging Display Technologies has developed a family of highly integrated Touch/Display solutions in sizes from 4.3” to 10.1” with different display resolutions called Smart Embedded.
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02/03/2020
Fairview Microwave has released a new series of Class AB broadband high power amplifier modules that incorporate GaN, LDMOS or VDMOS semiconductor technology.
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25/02/2020
Huawei has unveiled its Huawei 5G CPE Pro 2, a next-gen smart router within the HUAWEI 5G CPE Pro series.
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24/02/2020
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?u-blox has announced its SARA-R4 family of LTE-M / NB-IoT and EGPRS cellular modules will include variants with the hardware and software features necessary to enable end-to-end security features and services for Internet of Things (IoT) data, devices, and ecosystems.
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21/02/2020
u-blox has announced the JODY-W3 series, multi-radio modules featuring Wi-Fi 6 with 2 x 2 MIMO and dual-mode Bluetooth 5.1.
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18/02/2020
Smiths Interconnect has announced the release of its SpaceNXT MWC Series of high reliability multi-way isolated splitters in high-frequency Ku-bands.
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11/02/2020
OMC has unveiled the FDE2850 series fibre optic transmitter (Tx) diode for use with 200µm glass fibre optic systems.
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31/01/2020
Murata has announced what it claims is the smallest LoRa-based module currently on the market, at just 10.0 mm x 8.0 mm x 1.6 mm.
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29/01/2020
?NXP Semiconductors has announced the availability of its QN9090 and QN9030 Bluetooth 5 System on Chip (SoC) with hardware compatible options for 802.15.4, Multiprotocol RF, and optional NFC technology.
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28/01/2020
Anritsu and Synopsys are jointly demonstrating the PCI Express (PCIe) 5.0 Rx LEQ Test System supporting compliance test items using Anritsu’s Signal Quality Analyzer-R MP1900A series PCI Express 5.0 test system and Synopsys’ DesignWare IP for PCIe.
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28/01/2020
?TE Connectivity has announced the expansion of its M12 portfolio, with A-, B- and D-coded versions of the right-angle connector.
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28/01/2020
binder has announced an M16 connector that is ASIG C485-compliant and suitable for application in the latest 5G wireless networks.
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27/01/2020
Anritsu has launched the ShockLine MS46131A USB vector network analyzer (VNA), the industry’s first modular 1-port VNA that supports measurement frequencies up to 43.5 GHz.
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16/01/2020
Panasonic Industry Europe has launched a new Bluetooth 5.0 Low Energy module based on the Nordic nRF52840 SoC single-chip controller.
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13/01/2020
Pixus Technologies has developed ruggedised versions of commercial software defined radios. The latest in the series is the RX310-2 that features standard commercially available TwinRX daughtercards from Ettus Research, a National Instruments brand.
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08/01/2020
Diodes has announced the BCR430UW6, a linear LED driver with ultra-low dropout voltage and constant current regulation between 5mA and 100mA.
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09/12/2019
TE Connectivity (TE) is introducing its thermal bridge technology that can provide up to two times better thermal resistance over traditional thermal technologies such as gap pads or thermal pads.
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